PTSM 0,5/ 7-2,5-H THR WH R32 - PCB terminal block Phoenix Contact

Mã sản phẩm: 1814540

Danh mục: PHOENIX CONTACT, Kết nối (Connect) Phoenix Contact 3,

PCB terminal block, nominal current: 6 A, rated voltage (III/2): 160 V, nominal cross section: 0.5 mm2, number of potentials: 7, number of rows: 1, number of positions per row: 7, product range: PTSM 0,5/..-H-THR WH, pitch: 2.5 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 °, color: signal white, Pin layout: Linear pinning, Solder pin [P]: 2.1 mm, number of solder pins per potential: 2, type of packaging: 32 mm wide tape

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Hãng sản xuất: PHOENIX CONTACT

Chất lượng: Mới 100%

Bảo hành: Chính hãng

Chứng từ: CO/CQ, hóa đơn VAT

Liên hệ(SĐT/Zalo): 0933612627

Mô tả

Type	Component suitable for through hole reflow
Product line	COMBICON Terminals XS
Product type	Printed circuit board terminal
Product family	PTSM 0,5/..-H-THR WH
Number of positions	7
Pitch	2.5 mm
Number of connections	7
Number of rows	1
Number of potentials	7
Pin layout	Linear pinning
Solder pins per potential	2

Nominal current I_N	6 A
Nominal voltage U_N	160 V
Degree of pollution	3
Rated voltage (III/3)	160 V
Rated surge voltage (III/3)	2.5 kV
Rated voltage (III/2)	160 V
Rated surge voltage (III/2)	2.5 kV
Rated voltage (II/2)	400 V
Rated surge voltage (II/2)	2.5 kV

Connection technology
Type	Component suitable for through hole reflow
Nominal cross section	0.5 mm²
Conductor connection
Connection method	Push-in spring connection
Conductor cross section rigid	0.14 mm² ... 0.5 mm²
Conductor cross section flexible	0.2 mm² ... 0.5 mm² (up to 0.75 mm² supported, with a stripping length of 7.5 mm and a rated insulation voltage of 32 V at III/2)
Conductor cross section AWG	26 ... 20
Conductor cross section flexible, with ferrule without plastic sleeve	0.25 mm² ... 0.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve	0.25 mm² ... 0.34 mm²
Stripping length	6 mm

Mounting type	THR soldering
Pin layout	Linear pinning
Connection method	Push-in spring connection
Processing notes
Process	Reflow/wave soldering
Moisture Sensitive Level	MSL 1
Classification temperature T_c	260 °C
Solder cycles in the reflow	3

Material data - contact
Note	WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material	Cu alloy
Surface characteristics	hot-dip tin-plated
Metal surface terminal point (top layer)	Tin (4 - 8 µm Sn)
Metal surface soldering area (top layer)	Tin (4 - 8 µm Sn)
Material data - housing
Color (Housing)	signal white (9003)
Insulating material	PA
Insulating material group	I
CTI according to IEC 60112	600
Flammability rating according to UL 94	V0

Dimensional drawing
Pitch	2.5 mm
Width [w]	18 mm
Height [h]	7.1 mm
Length [l]	10 mm
Installed height	5 mm
Solder pin length [P]	2.1 mm
Pin dimensions	0.3 x 0.8 mm
PCB design
Pin spacing	2.5 mm
Hole diameter	1.2 mm

Air clearances and creepage distances \|
Insulating material group	I
Rated insulation voltage (III/3)	160 V
Rated surge voltage (III/3)	2.5 kV
Rated insulation voltage (III/2)	160 V
Rated surge voltage (III/2)	2.5 kV
Rated insulation voltage (II/2)	400 V
Rated surge voltage (II/2)	2.5 kV

Ambient conditions
Ambient temperature (operation)	-40 °C ... 100 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport)	-40 °C ... 70 °C
Relative humidity (storage/transport)	30 % ... 70 %
Ambient temperature (assembly)	-5 °C ... 100 °C