IDC 0,3/ 2-3,81 - PCB terminal block Phoenix Contact

Mã sản phẩm: 1706170

Danh mục: PHOENIX CONTACT, Kết nối (Connect) Phoenix Contact 3,

PCB terminal block, nominal current: 5 A, rated voltage (III/2): 160 V, nominal cross section: 0.34 mm2, number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: IDC 0,3, pitch: 3.81 mm, connection method: Displacement connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.4 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

Liên hệ mua hàng

Hãng sản xuất: PHOENIX CONTACT

Chất lượng: Mới 100%

Bảo hành: Chính hãng

Chứng từ: CO/CQ, hóa đơn VAT

Liên hệ(SĐT/Zalo): 0933612627

Mô tả

Type	PC termination block
Product line	COMBICON Terminals XS
Product type	Printed circuit board terminal
Product family	IDC 0,3
Number of positions	2
Pitch	3.81 mm
Number of connections	2
Number of rows	1
Number of potentials	2
Pin layout	Linear pinning
Solder pins per potential	1

Nominal current I_N	5 A
Nominal voltage U_N	160 V
Degree of pollution	3
Rated voltage (III/3)	160 V
Rated surge voltage (III/3)	2.5 kV
Rated voltage (III/2)	160 V
Rated surge voltage (III/2)	2.5 kV
Rated voltage (II/2)	320 V
Rated surge voltage (II/2)	2.5 kV

Connection technology
Type	PC termination block
Nominal cross section	0.34 mm²
Conductor connection
Connection method	Displacement connection
Conductor cross section rigid	0.13 mm² ... 0.34 mm²
Conductor cross section flexible	0.22 mm² ... 0.34 mm²
Conductor cross section AWG	26 ... 22

Mounting type	Wave soldering
Pin layout	Linear pinning
Connection method	Displacement connection

Material data - contact
Note	WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material	Cu alloy
Surface characteristics	Tin-plated
Metal surface terminal point (top layer)	Tin (5 - 7 µm Sn)
Metal surface terminal point (middle layer)	Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer)	Tin (5 - 7 µm Sn)
Metal surface soldering area (middle layer)	Nickel (2 - 3 µm Ni)
Material data - housing
Color (Housing)	green (6021)
Insulating material	PA
Insulating material group	I
CTI according to IEC 60112	600
Flammability rating according to UL 94	V0
Glow wire flammability index GWFI according to EN 60695-2-12	850
Glow wire ignition temperature GWIT according to EN 60695-2-13	775
Temperature for the ball pressure test according to EN 60695-10-2	125 °C
Material data – actuating element
Insulating material	PA
Insulating material group	I
CTI according to IEC 60112	600
Flammability rating according to UL 94	V0
Glow wire flammability index GWFI according to EN 60695-2-12	850
Glow wire ignition temperature GWIT according to EN 60695-2-13	775
Temperature for the ball pressure test according to EN 60695-10-2	125 °C

Dimensional drawing
Pitch	3.81 mm
Width [w]	8.81 mm
Height [h]	22.2 mm
Length [l]	12.4 mm
Installed height	18.8 mm
Solder pin length [P]	3.4 mm
Pin dimensions	1 x 0.4 mm

Air clearances and creepage distances \|
Specification	IEC 60664-1:2007-04
Insulating material group	I
Comparative tracking index (IEC 60112)	CTI 600
Rated insulation voltage (III/3)	160 V
Rated surge voltage (III/3)	2.5 kV
minimum clearance value - non-homogenous field (III/3)	1.5 mm
minimum creepage distance (III/3)	2 mm
Rated insulation voltage (III/2)	160 V
Rated surge voltage (III/2)	2.5 kV
minimum clearance value - non-homogenous field (III/2)	1.5 mm
minimum creepage distance (III/2)	1.5 mm
Rated insulation voltage (II/2)	320 V
Rated surge voltage (II/2)	2.5 kV
minimum clearance value - non-homogenous field (II/2)	1.5 mm
minimum creepage distance (II/2)	1.6 mm

Ambient conditions
Ambient temperature (operation)	-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)	-40 °C ... 70 °C
Relative humidity (storage/transport)	30 % ... 70 %
Ambient temperature (assembly)	-5 °C ... 100 °C