HBUS 107,6-16P-1S DEV-KIT BK - DIN rail bus connectors Phoenix Contact

Mã sản phẩm: 2202545

Bus connector to connect BC modules on the DIN rail; suitable for BC DEV-KITS, contains HBUS 107,6 and pin strip

Hãng sản xuất: PHOENIX CONTACT

Chất lượng: Mới 100%

Bảo hành: Chính hãng

Chứng từ: CO/CQ, hóa đơn VAT

Liên hệ(SĐT/Zalo): 0933612627

Pitch	2.54 mm
Width [w]	107.6 mm

Material data - contact
Contact material	Cu alloy
Surface characteristics	Completely gold-plated
Material data - housing
Color (Housing)	black (9005)
Insulating material	PA
Insulating material group	I
CTI according to IEC 60112	600
Flammability rating according to UL 94	V0

Air clearances and creepage distances \|
Specification	IEC 60664-1:2007-04
Insulating material group	I
Rated insulation voltage (III/3)	30 V
Rated surge voltage (III/3)	0.8 kV
minimum clearance value - non-homogenous field (III/3)	0.8 mm
minimum creepage distance (III/3)	1.3 mm
Rated insulation voltage (III/2)	30 V
Rated surge voltage (III/2)	0.8 kV
minimum clearance value - non-homogenous field (III/2)	0.2 mm
minimum creepage distance (III/2)	0.53 mm
Rated insulation voltage (II/2)	100 V
Rated surge voltage (II/2)	0.8 kV
minimum clearance value - non-homogenous field (II/2)	0.2 mm
minimum creepage distance (II/2)	0.71 mm

Vibration test
Specification	IEC 60068-2-6:2007-12
Frequency	10 - 150 - 10 Hz
Sweep speed	1 octave/min
Amplitude	0.15 mm (10 Hz ... 58.1 Hz)
Sweep speed	20 m/s²
Test duration per axis	2.5 h
Durability test
Specification	IEC 60512-9-1:2010-03
Impulse withstand voltage at sea level	0.91 kV
Contact resistance R₁	23.9 mΩ
Contact resistance R₂	24 mΩ
Insertion/withdrawal cycles	25
Climatic test
Specification	DIN 50018:2013-05
Corrosive stress	0.2 dm³SO₂on 300 dm³/40 °C/1 cycle
Thermal stress	100 °C/168 h
Power-frequency withstand voltage	0.55 kV
Glow-wire test
Specification	IEC 60695-2-10:2013-04
Temperature	850 °C
Time of exposure	30 s
Shocks
Specification	IEC 60068-2-27:2008-02
Pulse shape	Semi-sinusoidal
Acceleration	150 m/s²
Shock duration	11 ms
Test directions	X-, Y- and Z-axis (pos. and neg.)
Ambient conditions
Ambient temperature (operation)	-40 °C ... 105 °C (dependent on the derating curve)
Ambient temperature (storage/transport)	-40 °C ... 55 °C
Relative humidity (storage/transport)	80 %
Ambient temperature (assembly)	-5 °C ... 100 °C